SikaBond® T-55 J

• LEED® EQc 4.1
• SCAQMD, Rule 1168
• BAAQMD, Reg. 8, Rule 51

Polyurethane

12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

SikaBond® T-55 J shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

+5 °C to +40 °C

SikaBond® T-55 J spreads very easily whilst maintaining stable trowel marks.

+15 °C to +35 °C

40% to 70%

During laying and until SikaBond® T-55 J has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without and between +20 °C and +35 °C with underfloor heating.

Permissible substrate moisture content without underfloor heating:

• 2.5% CM for cement screeds.
• 0.5% CM for anhydrite screeds.
• 3–12% CM for magnetite flooring (depending on the organic content).

Permissible substrate moisture content for use with underfloor heating:

• 1.8% CM for cement screeds.
• 0.3% CM for anhydrite screeds.
• 3–12% CM for magnetite flooring (depending on the organic content).

Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer.

3.0 mm/24 hours approx. (23 °C / 50% r.h.)

60 minutes approx. (23 °C / 50% r.h.)

Full Surface Bonding:

• 600−800 g/m² with notched trowel B3 (TKB Germany) e.g. for lam parquet, mosaic parquet and industrial parquet.
• 700−900 g/m² with notched trowel B6 (TKB Germany) or SC+ MB (US Standard) e.g. for engineered wood strips and planks, lam and mosaic parquet.
• 800−1000 g/m² with notched trowel B11 (TKB Germany) or P5 (US Standard) e.g. solid wood, engineered long-strips and panels, industrial parquet, other residential wood floors and paving, and chipboard.

For bonding long or wide boards, or when working on uneven substrates, it may be necessary to use a notched trowel with bigger notches to ensure that a sufficient amount of SikaBond® T-55 J is applied to provide a uniform adhesive surface and prevent hollow sections i.e. without full surface bond.
For substrates primed with Sika^® Primer MR Fast or Sika^® Primer MB, the consumption of SikaBond® T-55 J may be reduced.

For the application of SikaBond® T-55 J all standard construction guidelines apply.
For further information, please refer to the Method Statement "Full Surface Bonding".

• The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
• Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
• Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
• Broadcast mastic asphalt must be primed with Sika^® Primer MR Fast or Sika^® Primer MB. For the instructions for use, please refer to the corresponding Product Data Sheet.
• Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika^® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
• Wood and/or gypsum boards (e.g. chipboard, plywood) must be glued and/or screwed to the substructure in order to be fixed to the substrate. For floating dry-floors, contact our Technical Service Department.
• For other substrates contact our Technical Service Department for advice and assistance.
• SikaBond® T-55 J can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.
• For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika^® Primer MB. For detailed instructions contact our Technical Service Department.

Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® TopClean T. Once cured, residual material can only be removed mechanically.